Rani, Adila, Velusamy, Dhinesh Babu, Kim, Richard Hahnkee , Chung, Kyungwha, Marques Mota, Filipe, Park, Cheolmin and Kim, Dong Ha (2016) Non-Volatile ReRAM Devices Based on Self-Assembled Multilayers of Modified Graphene Oxide 2D Nanosheets. Small, 12 (44). pp. 6167-6174. ISSN 1613-6810
Full content URL: https://doi.org/10.1002/smll.201602276
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(2016) Small 12, 6167.pdf - Whole Document Restricted to Repository staff only 1MB |
Item Type: | Article |
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Item Status: | Live Archive |
Abstract
2D nanomaterials have been actively utilized in non-volatile resistive switching random access memory (ReRAM) devices due to their high flexibility, 3D-stacking capability, simple structure, transparency, easy fabrication, and low cost. Herein, it demonstrates re-writable, bistable, transparent, and flexible solution-processed crossbar ReRAM devices utilizing graphene oxide (GO) based multilayers as active dielectric layers. The devices employ single- or multi-component-based multilayers composed of positively charged GO (N-GO(+) or NS-GO(+)) with/without negatively charged GO(-) using layer-by-layer assembly method, sandwiched between Al bottom and Au top electrodes. The device based on the multi-component active layer Au/[N-GO(+)/GO(-)]n/Al/PES shows higher ON/OFF ratio of ≈105 with switching voltage of −1.9 V and higher retention stability (≈104 s), whereas the device based on single component (Au/[N-GO(+)]n/Al/PES) shows ≈103 ON/OFF ratio at ±3.5 V switching voltage. The superior ReRAM properties of the multi-component-based device are attributed to a higher coating surface roughness. The Au/[N-GO(+)/GO(–)]n/Al/PES device prepared from lower GO concentration (0.01%) exhibits higher ON/OFF ratio (≈109) at switching voltage of ±2.0 V. However, better stability is achieved by increasing the concentration from 0.01% to 0.05% of all GO-based solutions. It is found that the devices containing MnO2 in the dielectric layer do not improve the ReRAM performance.
Keywords: | 2D nanosheet multilayers, graphene oxide, layer-by-layer self-assembly, resistive random access memory |
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Subjects: | F Physical Sciences > F110 Applied Chemistry |
Divisions: | College of Science > School of Chemistry |
ID Code: | 53655 |
Deposited On: | 21 Mar 2023 05:25 |
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