The impact of thermal strain rate on laser bonding of polymer films paper

Dowding, Colin (2012) The impact of thermal strain rate on laser bonding of polymer films paper. In: ICALEO 2012 - 31st International Congress on Applications of Lasers and Electro-Optics, 23 - 27 September 2012, Anaheim, CA; United States.

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Item Type:Conference or Workshop contribution (Paper)
Item Status:Live Archive


This work investigates the effectiveness of using a 10.6μm CO 2 marking laser to activate a thermally sensitive adhesive in the bonding of a thin linear low density polyethylene film to a polypropylene substrate. The potential technical hurdle of bubbling has been witnessed and described, this prevented contact between the two and a viable bond. The Gaussian profile of the laser used caused the centre of the bond to be over irradiated whilst the edge was under-irradiated; this, limited the real area on which an effective bond was achieved.

Additional Information:Conference Code:102085
Keywords:Gaussian profiles, Laser bonding, Linear low density, Thermal strain, Thermally sensitives, Carbon dioxide, Polymer films, Polypropylenes, Bonding
Subjects:G Mathematical and Computer Sciences > G400 Computer Science
Divisions:College of Science > School of Computer Science
ID Code:13487
Deposited On:07 Mar 2014 11:39

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